DIVIDENDS

Company NameDatePurpose
+ Ruch SoyaInd
24/04/2026Dividend (%) : 87.50, RecordDate - 25/04/2026
+ Moldtek Plas
24/04/2026Dividend (%) : 40.00, RecordDate - 24/04/2026
+ HCLTechnolog
24/04/2026Dividend (%) : 1200.00, RecordDate - 25/04/2026